For advanced thermal management in EV battery packs and power conversion applications, CGW thermal gap fillers and thermal adhesive systems that accommodate the ever-growing challenges in EV and CAM energy storage systems are used.

•    SEKISUI base formulations are adjustable to various mechanical requirements.
•    Outstanding battery performance, range, and lifetime.
•    High adaptability and design-to-cost efficiency to drive innovation further.

Used for electronic components with high energy density, SEKISUI thermally conductive CGW gap filler materials connect critical components in EV powertrain applications.

•    Advanced thermal management for a high energy density in a small form factor.
•    Wide range of thermal performance levels with up to 6 W/mK thermal conductivity
•    High adaptability and design-to-cost efficiency to drive innovation further.

Providing essential adhesive features in frames and panels for CID, HUD; interfaces, and control units, functional foam tapes from our 5200 series are used in automotive interior.

•    High adhesive strength and durability to absorb high impacts.
•    Bond well onto uneven surfaces, offering excellent water- and dustproofing.
•    Wide variety of thicknesses, suitable to various designs, even curved surfaces.

For bonding, sealing, and shielding in electronic and automotive applications such as HUD, CDI units, and control panels, adhesive resins like Photolec are essential.

•    Wide choice of curing modes – instant or delayed UV-, heat- or moisture curing.
•    Highest material quality: Low contamination, low outgas & halogen free grades.
•    Vast range of available characteristics matching various project requirements.

For gap control in control units, intake manifolds, pressure sensors, smart glasses, head-up-displays or electrical systems, adhesives like our Micropearl product series are used.

•    One of the world’s most extensive selection of mono dispersed micro particles.
•    Uniform particle sizes with CV of ≤ 7%, covering a range of 3 μm to 600 μm.
•    Excellent resistance against heat, chemical substances, and organic solvents.

Providing flame-retardant properties and covering wide range of applications, Alveolit also excels in its easy converting due to smooth-surfaced foam skin on both sides.

•    Achieves class B flammability rating in accordance with EN 13501-1. 
•    Prevents damage caused by dropping.
•    Prevents damage caused by water and dust.

Optimizing thermal management in high-performance power modules for wind and solar power stations, MANION-HST utilizes a carbon fiber-filled silicone sheet with excellent reliability and easy maintainability features.

•    Optimizes the performance of power modules.
•    Provides a superior thermal conductivity of 25W/mK.

To protect sensitive components in the electronics & semiconductor industry from damage caused by discharges, ESLON®-DC ESD plastic sheets are applied in electronic equipment.

•    Secures electronic equipment from damage caused by electrostatic discharges.
•    High transparency, fabrication, and installation.
•    Wide selection of materials, thickness, and colors.

Used as temporary adhesive film for wafer manufacturing, our SELFA series of UV release tapes feature a controlled self-releasing function.

•    Easy peeling and handling processes using UV to safely and efficiently de-bond.
•    Excellent heat and chemical resistance while very low risk for residue.
•    High adhesion single- or double-sided tape with gas controlled debonding system.

To temporarily secure industrial components during processing, thermo-release tapes like our innovative Advancell tape solutions are applied.

•    Narrow particle distribution.
•    Wide range of release temperatures available.
•    Lightweight and compatible with an array of base materials, such as PVC, EPDM, TPV, orPP.

For the manufacturing of printed circuit boards, low outgas release films ensure clean processing with high mechanical strength and thermal stability.

•    Low outgas clean film featuring a thermal stability polymer.
•    High mechanical strength in tensile force, breaking elongation & tear strength.
•    Excellent dimensional stability ensuring low change at high temperatures.

Applications like ceramic binders, special coating, or adhesives for microchips and electronic components rely on solutions like S-LEC® polyvinyl acetal resin. It offers:

•    Low particle, 
•    superior performance, and 
•    high heat stability and glass transition temperature.